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2月 24, 2025
项目新闻
碳化硅:从专用走向主流市场的半导体
虽然几乎每种电子产品都内置了硅芯片,但有些应用对硅芯片的效率要求会更高。碳化硅芯片作为硅芯片的高性能替代品,愈发得到广泛应用,而 VAT 提供的真空解决方案能够使碳化硅芯片在越来越多的应用中可持续使用。(2分钟阅读)
Zana Mamelli |
Baader Helvea |
zmamelli@helvea.com |
Didier Scemama |
Bank of America |
didier.scemama@bofa.com |
James Winchester |
Barclays |
james.winchester@barclays.com |
Patrick Laager |
Berenberg |
patrick.laager@berenberg.de |
Martin Jungfleisch |
BNP Paribas Exane |
martin.jungfleisch@bnpparibas.com |
Robert Sanders |
Deutsche Bank |
rob.sanders@db.com |
Olivia Honychurch |
Jefferies |
ohonychurch@jefferies.com |
Sandeep Deshpande |
JP Morgan |
sandeep.s.deshpande@jpmorgan.com |
Craig Abbott |
Kepler Cheuvreux |
cabbott@keplercheuvreux.com |
Nigel van Putten |
Morgan Stanley |
nigel.putten@morganstanley.com |
Nejc Lavric |
Octavian AG |
nejc.lavric@octavian.ch |
Martin Marandon-Carlhian |
ODDO BHF |
martin.marandon-carlhian@oddo-bhf.com |
Robin Seydoux |
Research Partners |
robin.seydoux@researchpartners.ch |
Sebastian Kuenne |
RBC Capital Markets |
sebastian.kuenne@rbccm.com |
Timm Schulze-Melander |
Redburn |
timm.schulze-melander@redburn.com |
Jürgen Wagner |
Stifel |
juergen.wagner@stifel.com |
Joern Iffert |
UBS |
joern.iffert@ubs.com |
Michael Foeth |
Vontobel |
michael.foeth@vontobel.ch |
Michael Inauen |
Zürcher Kantonalbank |
michael.inauen@zkb.ch |